XC3S1400AN-4FG676C Xilinx Inc.

Part Number:
XC3S1400AN-4FG676C
Custom Part #:
HS100138
Manufacturer:
Xilinx Inc.
Category:
Integrated Circuits (ICs)
Price:
$ 91.9900
RoHS:
RoHS
Description:
The Spartan-3AN FPGA features a rich network of traces that interconnect all five functional elements, transmitting signals among them. Each functional element has an associated switch matrix that permits multiple connections to the routing.
Datasheet:
XC3S1400AN-4FG676C Datasheet
Authorized Distributor:
EOLSEMI Worldway Electronics
XC3S1400AN-4FG676C Xilinx Inc. Photos
  • XC3S1400AN-4FG676C Xilinx Inc.
  • XC3S1400AN-4FG676C Xilinx Inc.
  • XC3S1400AN-4FG676C Xilinx Inc.
XC3S1400AN-4FG676C Xilinx Inc. Description
The Spartan®-3AN FPGA family combines the best attributes of a leading edge, low cost FPGA with nonvolatile technology across a broad range of densities. The family combines all the features of the Spartan-3A FPGA family plus leading technology in-system Flash memory for configuration and nonvolatile data storage. The Spartan-3AN FPGAs are part of the Extended Spartan-3A family, which also includes the Spartan-3A FPGAs and the higher density Spartan-3A DSP FPGAs. The Spartan-3AN FPGA family is excellent for space-constrained applications such as blade servers, medical devices, automotive infotainment, telematics, GPS, and other small consumer products. Combining FPGA and Flash technology minimizes chip count, PCB traces and overall size while increasing system reliability. The Spartan-3AN FPGA internal configuration interface is completely self-contained, increasing design security. The family maintains full support for external configuration. The Spartan-3AN FPGA is the world’s first nonvolatile FPGA with MultiBoot, supporting two or more configuration files in one device, allowing alternative configurations for field upgrades, test modes, or multiple system configurations.
XC3S1400AN-4FG676C Xilinx Inc. Specifications
Features
• The new standard for low cost nonvolatile FPGA solutions
• Eliminates traditional nonvolatile FPGA limitations with the
advanced 90 nm Spartan-3A device feature set
• Memory, multipliers, DCMs, SelectIO, hot swap, power
management, etc.
• Integrated robust configuration memory
• Saves board space
• Improves ease-of-use
• Simplifies design
• Reduces support issues
• Plentiful amounts of nonvolatile memory available to the user
• Up to 11+ Mb available
• MultiBoot support
• Embedded processing and code shadowing
• Scratchpad memory
• Robust 100K Flash memory program/erase cycles
• 20 years Flash memory data retention
• Security features provide bitstream anti-cloning protection
• Buried configuration interface
• Unique Device DNA serial number in each device for
design Authentication to prevent unauthorized copying
• Flash memory sector protection and lockdown
• Configuration watchdog timer automatically recovers from
configuration errors
• Suspend mode reduces system power consumption
• Retains all design state and FPGA configuration data
• Fast response time, typically less than 100 μs
• Full hot-swap compliance
• Multi-voltage, multi-standard SelectIO™ interface pins
• Up to 502 I/O pins or 227 differential signal pairs
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal
standards
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Up to 24 mA output drive
• 3.3V ±10% compatibility and hot swap compliance
• 622+ Mb/s data transfer rate per I/O
• DDR/DDR2 SDRAM support up to 400 Mb/s
• LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL
differential I/O
• Abundant, flexible logic resources
• Densities up to 25,344 logic cells
• Optional shift register or distributed RAM support
• Enhanced 18 x 18 multipliers with optional pipeline
• Hierarchical SelectRAM™ memory architecture
• Up to 576 Kbits of dedicated block RAM
• Up to 176 Kbits of efficient distributed RAM
• Up to eight Digital Clock Managers (DCMs)
• Eight global clocks and eight additional clocks per each half
of device, plus abundant low-skew routing
• Complete Xilinx® ISE® and WebPACK™ software
development system support
• MicroBlaze™ and PicoBlaze embedded processor cores
• Fully compliant 32-/64-bit 33 MHz PCI™ technology support
• Low-cost QFP and BGA Pb-free (RoHS) packaging options
• Pin-compatible with the same packages in the
Spartan-3A FPGA family
Other Authorized Suppliers

Digi-Key ECIA (NEDA) Member • Authorized Distributor

Part # Manufacturer Description Stock Price
XC3S1400AN-4FG676C DISTI # XC3S1400AN-4FG676C-ND
Xilinx IC FPGA 502 I/O 676FBGA RoHS: Not compliant Min Qty: 40 Container: Tray Temporarily Out of Stock
  • 40 $118.5800

Avnet ECIA (NEDA) Member • Authorized Distributor

Part # Manufacturer Description Stock Price
XC3S1400AN-4FFG676C DISTI # XC3S1400AN-4FG676C
Xilinx FPGA Spartan-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V 676-Pin FBGA - Trays (Alt: XC3S1400AN-4FG676C) RoHS: Not Compliant Min Qty: 1 Container: Tray Americas - 0
  • 1 $91.9900
XC3S1400AN-4FFG676C DISTI # XC3S1400AN-4FG676C
Xilinx FPGA Spartan-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V 676-Pin FBGA (Alt: XC3S1400AN-4FG676C) RoHS: Not Compliant Min Qty: 40 Asia - 0
  • 40 $111.4474
  • 80 $110.0000
  • 120 $108.5897
  • 200 $107.2152
  • 400 $105.8750
  • 1000 $103.2927
  • 2000 $100.8333